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Residual thermo-mechanical stresses in thinned-chip assemblies

dc.contributor.authorLeseduarte, S.
dc.contributor.authorMarco, S.
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorMarty, A.
dc.contributor.authorPinel, S.
dc.contributor.authorVendier, O.
dc.contributor.authorCoello-Vera, A.
dc.date.accessioned2021-10-14T11:29:34Z
dc.date.available2021-10-14T11:29:34Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3615
dc.sourceIIOimport
dc.titleResidual thermo-mechanical stresses in thinned-chip assemblies
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage306
dc.source.endpage311
dc.source.conferenceProceedings of 5th International Workshop on Thermal Investigations of ICs and Microstructures - THERMINIC
dc.source.conferencedate3/10/1999
dc.source.conferencelocationRome Italy
imec.availabilityPublished - open access


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