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Improving the QFN Board level Reliability using Low Melting LMPAQ Solder

dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorLauwaert, R.
dc.contributor.authorTelizsewski, S.
dc.contributor.authorWerkhoven, D.
dc.date.accessioned2021-10-29T06:41:51Z
dc.date.available2021-10-29T06:41:51Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36199
dc.sourceIIOimport
dc.titleImproving the QFN Board level Reliability using Low Melting LMPAQ Solder
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceIEEE Reliability for Electronics and Photonics Packaging Symposium - REPP
dc.source.conferencedate12/11/2020
dc.source.conferencelocationvirtual virtual
imec.availabilityPublished - open access


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