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Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology

dc.contributor.authorKondo, Tsuyoshi
dc.contributor.authorBan, N.
dc.contributor.authorEbizuka, Y.
dc.contributor.authorToyoda, Y.
dc.contributor.authorYamada, Y.
dc.contributor.authorKashiwa, T.
dc.contributor.authorKoike, H.
dc.contributor.authorShindo, H.
dc.contributor.authorCharley, Anne-Laure
dc.contributor.authorSaib, Mohamed
dc.contributor.authorVan Roey, Frieda
dc.contributor.authorDe Bisschop, Peter
dc.contributor.authorDe Simone, Danilo
dc.contributor.authorBeral, Christophe
dc.contributor.authorLorusso, Gian
dc.date.accessioned2021-10-31T09:17:09Z
dc.date.available2021-10-31T09:17:09Z
dc.date.issued2021
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36865
dc.sourceIIOimport
dc.titleMassive metrology and inspection solution for EUV by area inspection SEM with machine learning technology
dc.typeProceedings paper
dc.contributor.imecauthorKondo, Tsuyoshi
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorVan Roey, Frieda
dc.contributor.imecauthorDe Bisschop, Peter
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.imecauthorBeral, Christophe
dc.contributor.imecauthorLorusso, Gian
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.contributor.orcidimecBeral, Christophe::0000-0003-1356-9186
dc.source.peerreviewyes
dc.source.beginpage1161111
dc.source.conferenceMetrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
dc.source.conferencedate22/02/2021
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2583691
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 11611


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