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Design and Manufacturing Technology of Advanced Multi-Die Packages on the 'Slope of Enlightenment': Where Is 3D-Test?

dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorStucchi, Michele
dc.contributor.authorVardaman, E. Jan
dc.contributor.authorArmstrong, Dave
dc.contributor.authorChen, Harry
dc.contributor.authorGoel, Sandeep Kumar
dc.contributor.authorHuang, Yu
dc.contributor.authorMcLaurin, Teresa
dc.date.accessioned2021-10-31T09:45:54Z
dc.date.available2021-10-31T09:45:54Z
dc.date.issued2021
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36952
dc.sourceIIOimport
dc.titleDesign and Manufacturing Technology of Advanced Multi-Die Packages on the 'Slope of Enlightenment': Where Is 3D-Test?
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorHuang, Yu
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conference2021 IEEE European Test Symposium (ETS)
dc.source.conferencedate24/05/2021
dc.source.conferencelocationBrugge Belgium
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9465435
imec.availabilityPublished - imec


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