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3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Webers, Tomas | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | de Vos, Joeri | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-11-02T15:55:38Z | |
dc.date.available | 2021-11-02T15:55:38Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 1936-3958 | |
dc.identifier.other | WOS:000701365300030 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/37459 | |
dc.source | WOS | |
dc.title | 3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Webers, Tomas | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | de Vos, Joeri | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
dc.identifier.eisbn | 978-1-7281-9764-7 | |
dc.source.numberofpages | 10 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 219 | |
dc.source.endpage | 228 | |
dc.source.conference | 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) | |
dc.source.conferencedate | JUL 21-23, 2020 | |
imec.availability | Under review |
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