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Effect of Cu on Al interfacial mass transport in bamboo rie and damscene (AlCu)

dc.contributor.authorProost, Joris
dc.contributor.authorLi, H.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T11:34:59Z
dc.date.available2021-10-14T11:34:59Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3767
dc.sourceIIOimport
dc.titleEffect of Cu on Al interfacial mass transport in bamboo rie and damscene (AlCu)
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage91
dc.source.endpage96
dc.source.conferenceMaterials Reliability in Microelectronics IX; 5-9 April 1999; San Francisco, Ca, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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