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Roles of additive during filling process of damascene structures with electrochemical deposited copper

dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBender, Hugo
dc.contributor.authorPalmans, Roger
dc.contributor.authorLagrange, Sébastien
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T11:35:28Z
dc.date.available2021-10-14T11:35:28Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3774
dc.sourceIIOimport
dc.titleRoles of additive during filling process of damascene structures with electrochemical deposited copper
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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