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Process development and characterization of 3D multi-die stacking
Publication:
Process development and characterization of 3D multi-die stacking
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Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gerets, Carine
;
Derakhshandeh, Aber
;
Bex, Pieter
;
Lofrano, Melina
;
Cherman, Vladimir
;
Fodor, Ferenc
;
De Wolf, Ingrid
;
Rebibis, Kenneth June
;
Beyer, Gerald
;
Miller, Andy
;
Beyne, Eric
Journal
na
Abstract
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1780
since deposited on 2021-11-02
Acq. date: 2025-12-16
Citations
Metrics
Views
1780
since deposited on 2021-11-02
Acq. date: 2025-12-16
Citations