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Process development and characterization of 3D multi-die stacking

dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Aber
dc.contributor.authorBex, Pieter
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorFodor, Ferenc
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-01-20T10:13:28Z
dc.date.available2021-11-02T16:03:21Z
dc.date.available2022-01-20T10:13:28Z
dc.date.issued2020
dc.identifier.issnna
dc.identifier.otherWOS:000631824100083
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38046.2
dc.sourceWOS
dc.titleProcess development and characterization of 3D multi-die stacking
dc.typeProceedings paper
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Aber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.eisbn978-1-7281-6293-5
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.conference8th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 15-18, 2020
dc.source.conferencelocationVestfold
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/38046.2*2022-01-20T10:12:26Zvalidation by library/open access desk
120.500.12860/380462021-11-02T16:03:21Z

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