Publication:

Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Date

2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00020
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Author(s)

Jourdain, Anne  
;
Schleicher, Filip  
;
De Vos, Joeri  
;
Stucchi, Michele  
;
Chery, Emmanuel  
;
Miller, Andy  
;
Beyer, Gerald  
;
Van der Plas, Geert  
;
Walsby, Edward
;
Roberts, Kerry
;
Ashraf, Huma
;
Thomas, Dave
;
Beyne, Eric  

Journal

na

Abstract

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2197 since deposited on 2021-11-02
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Acq. date: 2025-12-13

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