Publication:

Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00046

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Journal

na

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1830 since deposited on 2021-11-02

Acq. date: 2026-01-08