dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Fodor, Ferenc | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | De Vos, Joeri | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2022-01-19T11:27:03Z | |
dc.date.available | 2021-11-02T16:04:30Z | |
dc.date.available | 2022-01-19T11:27:03Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000620983200034 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38146.2 | |
dc.source | WOS | |
dc.title | Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Fodor, Ferenc | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Iacovo, Serena | |
dc.contributor.imecauthor | De Vos, Joeri | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/ECTC32862.2020.00046 | |
dc.identifier.eisbn | 978-1-7281-6180-8 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 216 | |
dc.source.endpage | 222 | |
dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | JUN 03-30, 2020 | |
dc.source.conferencelocation | Orlando, FL, USA | |
dc.source.journal | na | |
imec.availability | Published - imec | |