Publication:

Process Window Enhancement of Via Holes for Fine Pitch RDL by Design Optimization

Date

2020-06

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00179

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Author(s)

Slabbekoorn, John

Journal

ectc

Metrics

1231 since deposited on 2021-11-02

3last month

Acq. date: 2026-01-09