Publication:
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects
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1796 since deposited on 2021-11-02
2last month
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Acq. date: 2026-01-06
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1796 since deposited on 2021-11-02
2last month
1last week
Acq. date: 2026-01-06
Citations