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Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
dc.contributor.author | Lesniewska, A. | |
dc.contributor.author | Roussel, P. J. | |
dc.contributor.author | Tierno, D. | |
dc.contributor.author | Gonzalez, V. Vega | |
dc.contributor.author | van der Veen, M. H. | |
dc.contributor.author | Verdonck, P. | |
dc.contributor.author | Jourdan, N. | |
dc.contributor.author | Wilson, C. J. | |
dc.contributor.author | Tokei, Zs | |
dc.contributor.author | Croes, K. | |
dc.date.accessioned | 2021-11-02T16:05:23Z | |
dc.date.available | 2021-11-02T16:05:23Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 1541-7026 | |
dc.identifier.other | WOS:000612717200119 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38210 | |
dc.source | WOS | |
dc.title | Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Lesniewska, A. | |
dc.contributor.imecauthor | Roussel, P. J. | |
dc.contributor.imecauthor | Tierno, D. | |
dc.contributor.imecauthor | Gonzalez, V. Vega | |
dc.contributor.imecauthor | van der Veen, M. H. | |
dc.contributor.imecauthor | Verdonck, P. | |
dc.contributor.imecauthor | Jourdan, N. | |
dc.contributor.imecauthor | Wilson, C. J. | |
dc.contributor.imecauthor | Tokei, Zs | |
dc.contributor.imecauthor | Croes, K. | |
dc.contributor.orcidimec | Tierno, D.::0000-0003-4915-904X | |
dc.identifier.eisbn | 978-1-7281-3199-3 | |
dc.source.numberofpages | 6 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Reliability Physics Symposium (IRPS) | |
dc.source.conferencedate | APR 28-MAY 30, 2020 | |
imec.availability | Under review |
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