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Electrochemical study of copper depostion on silicon surfaces in HF solutions

dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorGomes, W. P.
dc.contributor.authorStrubbe, K.
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T11:42:40Z
dc.date.available2021-10-14T11:42:40Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3874
dc.sourceIIOimport
dc.titleElectrochemical study of copper depostion on silicon surfaces in HF solutions
dc.typeProceedings paper
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage156
dc.source.endpage159
dc.source.conferenceElectrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II
dc.source.conferencedate3/05/1999
dc.source.conferencelocationSeattle, WA USA
imec.availabilityPublished - open access
imec.internalnotesElectrochemical Society Proceedings ; Vol. 99-9


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