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dc.contributor.authorThompson, Heike
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorBeyer, Gerald
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVervoort, Iwan
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorStruyf, Herbert
dc.contributor.authorPalmans, Roger
dc.contributor.authorForester, Lynn
dc.date.accessioned2021-10-14T11:43:09Z
dc.date.available2021-10-14T11:43:09Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3880
dc.sourceIIOimport
dc.titleEtch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
dc.typeProceedings paper
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage59
dc.source.endpage61
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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