Publication:

Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects

Date

2021
Journal Article Review
https://doi.org/10.1149/2162-8777/abe7a9
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Published version 1.66 MB

Author(s)

Ceric, H.
;
Selberherr, S.
;
de Orio, R. L.
;
Zahedmanesh, Houman  
;
Croes, Kristof  

Journal

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY

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2017 since deposited on 2022-02-23
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1801 since deposited on 2022-02-23
Acq. date: 2026-08-10

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