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A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGerets, Carine
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorHou, Lin
dc.contributor.authorCochet, Tom
dc.contributor.authorDe Preter, Inge
dc.contributor.authorWebers, Tomas
dc.contributor.authorBex, Pieter
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorMaehara, Masataka
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorBertheau, Julien
dc.contributor.authorBeyne, Eric
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMiller, Andy
dc.date.accessioned2022-03-16T14:50:52Z
dc.date.available2022-03-16T14:50:52Z
dc.date.issued2021
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000702282700171
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39460
dc.sourceWOS
dc.titleA study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorMaehara, Masataka
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLa Tulipe, Douglas Charles
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.identifier.doi10.1109/ECTC32696.2021.00183
dc.identifier.eisbn978-0-7381-4523-5
dc.source.numberofpages6
dc.source.peerreviewyes
dc.source.beginpage1119
dc.source.endpage1124
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
imec.availabilityPublished - imec


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