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Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

dc.contributor.authorChery, Emmanuel
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorPinho, Nelson
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2022-03-16T14:56:03Z
dc.date.available2022-03-16T14:56:03Z
dc.date.issued2021
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000702282700053
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39461
dc.sourceWOS
dc.titleAdvances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers
dc.typeProceedings paper
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC32696.2021.00064
dc.identifier.eisbn978-0-7381-4523-5
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage340
dc.source.endpage346
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
imec.availabilityPublished - imec


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