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Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
dc.contributor.author | Sisto, Giuliano | |
dc.contributor.author | Chen, Rongmei | |
dc.contributor.author | Chou, Richard | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Rod Metcalfe | |
dc.contributor.author | Milojevic, Dragomir | |
dc.date.accessioned | 2022-03-26T02:08:17Z | |
dc.date.available | 2022-03-26T02:08:17Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 1544-5623 | |
dc.identifier.other | WOS:000766322000004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39525 | |
dc.source | WOS | |
dc.title | Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited) | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Chen, Rongmei | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Milojevic, Dragomir | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/SLIP52707.2021.00011 | |
dc.identifier.eisbn | 978-1-6654-0083-1 | |
dc.source.numberofpages | 7 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 17 | |
dc.source.endpage | 23 | |
dc.source.conference | 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP) | |
dc.source.conferencedate | NOV 04, 2021 | |
imec.availability | Under review |
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