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Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
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Authors
Vandevelde, Bart
;
Beyne, Eric
;
Van Puymbroeck, Jan
;
Heerman, M.
Conference
Area Array Packaging Technologies Workshop
Title
Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
Publication type
Oral presentation
Embargo date
9999-12-31
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