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Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.date.accessioned2021-10-14T11:51:17Z
dc.date.available2021-10-14T11:51:17Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3967
dc.sourceIIOimport
dc.titleEffect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceArea Array Packaging Technologies Workshop
dc.source.conferencedate15/11/1999
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - open access


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