Publication:
Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package
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1925 since deposited on 2021-10-14
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Acq. date: 2026-07-16
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1925 since deposited on 2021-10-14
1last month
1last week
Acq. date: 2026-07-16
Citations