dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Van Puymbroeck, Jan | |
dc.contributor.author | Heerman, M. | |
dc.date.accessioned | 2021-10-14T11:51:23Z | |
dc.date.available | 2021-10-14T11:51:23Z | |
dc.date.issued | 1999 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3968 | |
dc.source | IIOimport | |
dc.title | Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Van Puymbroeck, Jan | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 392 | |
dc.source.endpage | 398 | |
dc.source.conference | Proceedings of the 12th European Microelectronics and Packaging Conference | |
dc.source.conferencedate | 7/06/1999 | |
dc.source.conferencelocation | Harrogate UK | |
imec.availability | Published - open access | |