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Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.date.accessioned2021-10-14T11:51:28Z
dc.date.available2021-10-14T11:51:28Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3969
dc.sourceIIOimport
dc.titleThermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage823
dc.source.endpage829
dc.source.conferenceProceedings of the Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/1999
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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