Publication:
Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1927 since deposited on 2021-10-14
4last month
Acq. date: 2026-01-08
Citations
Metrics
Views
1927 since deposited on 2021-10-14
4last month
Acq. date: 2026-01-08
Citations