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Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
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Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
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Date
1999
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
;
Van Puymbroeck, Jan
;
Heerman, M.
Journal
Abstract
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1923
since deposited on 2021-10-14
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Acq. date: 2025-12-10
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Metrics
Views
1923
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-10
Citations