Publication:
Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Van Puymbroeck, Jan | |
| dc.contributor.author | Heerman, M. | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Van Puymbroeck, Jan | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T11:51:28Z | |
| dc.date.available | 2021-10-14T11:51:28Z | |
| dc.date.issued | 1999 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3969 | |
| dc.source.beginpage | 823 | |
| dc.source.conference | Proceedings of the Electronic Components and Technology Conference - ECTC | |
| dc.source.conferencedate | 1/06/1999 | |
| dc.source.conferencelocation | San Diego, CA USA | |
| dc.source.endpage | 829 | |
| dc.title | Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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