dc.contributor.author | Soulie, Jean-Philippe | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Swerts, Johan | |
dc.contributor.author | Adelmann, Christoph | |
dc.date.accessioned | 2022-07-08T10:01:13Z | |
dc.date.available | 2022-05-05T02:17:26Z | |
dc.date.available | 2022-07-05T12:58:49Z | |
dc.date.available | 2022-07-08T10:01:13Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2380-632X | |
dc.identifier.other | WOS:000784773200031 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39739.3 | |
dc.source | WOS | |
dc.title | Aluminide intermetallics for advanced interconnect metallization: thin film studies | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Soulie, Jean-Philippe | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Swerts, Johan | |
dc.contributor.imecauthor | Adelmann, Christoph | |
dc.contributor.orcidimec | Soulie, Jean-Philippe::0000-0002-5956-6485 | |
dc.contributor.orcidimec | Adelmann, Christoph::0000-0002-4831-3159 | |
dc.identifier.doi | 10.1109/IITC51362.2021.9537441 | |
dc.identifier.eisbn | 978-1-7281-7632-1 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC) | |
dc.source.conferencedate | JUL 06-09, 2021 | |
dc.source.conferencelocation | online | |
dc.source.journal | IEEE | |
imec.availability | Published - open access | |