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Aluminide intermetallics for advanced interconnect metallization: thin film studies
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2021041350_Soulie.pdf (501.7Kb)
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Authors
Soulie, Jean-Philippe
;
Tokei, Zsolt
;
Swerts, Johan
;
Adelmann, Christoph
DOI
10.1109/IITC51362.2021.9537441
EISBN
978-1-7281-7632-1
ISSN
2380-632X
Conference
IEEE International Interconnect Technology Conference (IITC)
Journal
IEEE
Title
Aluminide intermetallics for advanced interconnect metallization: thin film studies
Publication type
Proceedings paper
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Conference contributions
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Date
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3
20.500.12860/39739.3
*
2022-07-08T10:00:17Z
validation by library/open access desk
2
20.500.12860/39739.2
2022-06-16T13:57:03Z
validation by imec author
1
20.500.12860/39739
2022-05-05T02:17:26Z
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