Browsing by author "Tokei, Zsolt"
Now showing items 1-20 of 502
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1/f noise measurements for faster electromigration characterization
Beyne, Sofie; Croes, Kristof; De Wolf, Ingrid; Tokei, Zsolt (2016) -
1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections
Beyne, Sofie; Croes, Kristof; De Wolf, Ingrid; Tokei, Zsolt (2016) -
1Xnm copper and low-k reliability
Tokei, Zsolt; Croes, Kristof (2011-09) -
21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV Lithography
Kim, Il Hwan; Kim, Insung; Park, Changmin; Lee, Jsiun; Ryu, Koungmin; De Schepper, P.; Doise, J.; Kocsis, M.; De Simone, Danilo; Kljucar, Luka; Das, Poulomi; Blanc, Romuald; Beral, Christophe; Severi, Joren; Vandenbroeck, Nadia; Foubert, Philippe; Charley, Anne-Laure; Oak, Apoorva; Xu, Dongbo; Gillijns, Werner; Mitard, Jerome; Tokei, Zsolt; van der Veen, Marleen; Heylen, Nancy; Teugels, Lieve; Le, Quoc Toan; Schleicher, Filip; Leray, Philippe; Ronse, Kurt (2021) -
300mm IGZO nFETs with low-T Ru contacts for localized doping and increased BEOL compatibility
Kljucar, Luka; Smets, Quentin; van Setten, Michiel; Mitard, Jerome; Belmonte, Attilio; Dekkers, Harold; Teugels, Lieve; Mao, Ming; Puliyalil, Harinarayanan; del Agua Borniquel, Jose Ignacio; Delhougne, Romain; Sankaran, Kiroubanand; Tokei, Zsolt (2020) -
300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections
Jourdan, Nicolas; Cellier, Daniel; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016) -
45nm nMOSFET with metal gate on thin SiON driving 1150μA/μm and off-state of 10nA/μm
Henson, Kirklen; Lander, Rob; Demand, Marc; Dachs, Charles; Kaczer, Ben; Deweerd, Wim; Schram, Tom; Tokei, Zsolt; Hooker, Jacob; Cubaynes, Florence; Beckx, Stephan; Boullart, Werner; Coenegrachts, Bart; Vertommen, Johan; Richard, Olivier; Bender, Hugo; Vandervorst, Wilfried; Kaiser, M.; Everaert, Jean-Luc; Jurczak, Gosia; Biesemans, Serge (2004) -
A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects
Stucchi, Michele; Roussel, Philippe; Tokei, Zsolt; Demuynck, Steven; Groeseneken, Guido (2011) -
A DRAM compatible Cu contact using self-aligned Ta-silicide and Ta-barrier
Zhao, Chao; Ahn, Jae Young; Horiguchi, Naoto; Demuynck, Steven; Tokei, Zsolt (2008) -
A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Hoofman, Romano; Michelon, Julien; Verheijden, G.J.A.M.; Waeterloos, Joost; Caluwaerts, Rudy; Schmidt, M.O.; Demeurisse, Caroline; Vandeweyer, Tom; Demuynck, Steven; Tokei, Zsolt; Beyer, Gerald (2004) -
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
A large scale systematic study of graphene/metal contact resistance using cTLM
Politou, Maria; Liu, Enlong; Asselberghs, Inge; Lee, ChangSeung; Martens, Koen; Radu, Iuliana; Tokei, Zsolt; Huyghebaert, Cedric; De Gendt, Stefan; Heyns, Marc (2014) -
A method to pattern tight tip-to-tip in 32nm-pitch N5 interconnect using Ru area selective deposition tone inversion process
Briggs, Basoene; Soethoudt, Job; Delabie, Annelies; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; Devriendt, Katia; Sebaai, Farid; Lorant, Christophe; Hody, Hubert (2018) -
A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow
Clark, William; Juncker, Aurelie; Paladugu, E.; Fried, David; Wilson, Chris; Pourtois, Geoffrey; Gallagher, Emily; de Jamblinne de Meux, Albert; Piumi, Daniele; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2016) -
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Lofrano, Melina; Gonzalez, Mario; Vandevelde, Bart; Tokei, Zsolt (2013) -
A NEMS based sensor to monitor stress in deep sub-micron Cu/Low-$k$ interconnects
Wilson, Chris; Croes, Kristof; Van Cauwenberghe, Marc; Tokei, Zsolt; Beyer, Gerald; Horsfall, Alton; O'Neill, Anthony (2009) -
A new perspective of barrier material evaluation and process optimization
Zhao, Larry; Tokei, Zsolt; Gianni, Giai Gischia; Volders, Henny; Beyer, Gerald (2009) -
A novel electromigration characterization method based on low-frequency noise measurements
Beyne, Sofie; Varela Pedreira, Olalla; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2019) -
A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007)