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Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication
dc.contributor.author | Okudur, Oguzhan Orkut | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Van den Bosch, Geert | |
dc.contributor.author | Rosmeulen, Maarten | |
dc.date.accessioned | 2022-05-05T02:17:26Z | |
dc.date.available | 2022-05-05T02:17:26Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2380-632X | |
dc.identifier.other | WOS:000784773200029 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39740 | |
dc.source | WOS | |
dc.title | Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Van den Bosch, Geert | |
dc.contributor.imecauthor | Rosmeulen, Maarten | |
dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
dc.contributor.orcidimec | Van den Bosch, Geert::0000-0001-9971-6954 | |
dc.contributor.orcidimec | Rosmeulen, Maarten::0000-0002-3663-7439 | |
dc.identifier.doi | 10.1109/IITC51362.2021.9537435 | |
dc.identifier.eisbn | 978-1-7281-7632-1 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC) | |
dc.source.conferencedate | JUL 06-09, 2021 | |
imec.availability | Under review |
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