Publication:

Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication

Date

2021-09
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537435
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Author(s)

Okudur, Oguzhan Orkut  
;
Gonzalez, Mario  
;
Van den Bosch, Geert  
;
Rosmeulen, Maarten  

Journal

na

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1729 since deposited on 2022-05-05
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