Publication:

Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication

Date

2021-09

Proceedings Paper

https://doi.org/10.1109/IITC51362.2021.9537435

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Author(s)

Okudur, Oguzhan Orkut

;

Gonzalez, Mario

;

Van den Bosch, Geert

;

Rosmeulen, Maarten

Journal

na

Metrics

1723 since deposited on 2022-05-05

Acq. date: 2025-12-16