Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication

dc.contributor.author	Okudur, Oguzhan Orkut
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Van den Bosch, Geert
dc.contributor.author	Rosmeulen, Maarten
dc.contributor.imecauthor	Okudur, Oguzhan Orkut
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Van den Bosch, Geert
dc.contributor.imecauthor	Rosmeulen, Maarten
dc.contributor.orcidimec	Okudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimec	Gonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimec	Van den Bosch, Geert::0000-0001-9971-6954
dc.contributor.orcidimec	Rosmeulen, Maarten::0000-0002-3663-7439
dc.date.accessioned	2022-05-06T09:46:48Z
dc.date.available	2022-05-05T02:17:26Z
dc.date.available	2022-05-06T06:24:20Z
dc.date.available	2022-05-06T09:46:48Z
dc.date.issued	2021-09
dc.identifier.doi	10.1109/IITC51362.2021.9537435
dc.identifier.eisbn	978-1-7281-7632-1
dc.identifier.issn	2380-632X
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/39740
dc.publisher	IEEE
dc.source.conference	IEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedate	JUL 06-09, 2021
dc.source.conferencelocation	Kyoto, Japan
dc.source.journal	na
dc.source.numberofpages	3
dc.title	Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication
dc.type	Proceedings paper
dspace.entity.type	Publication
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