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IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

dc.contributor.authorGenneret, B.
dc.contributor.authorChou, R.
dc.contributor.authorSisto, Giuliano
dc.contributor.authorChehab, Bilal
dc.contributor.authorBaert, Rogier
dc.contributor.authorChen, Rongmei
dc.contributor.authorWeckx, Pieter
dc.contributor.authorRyckaert, Julien
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorMilojevic, Dragomir
dc.date.accessioned2022-05-05T09:31:43Z
dc.date.available2022-05-05T02:17:41Z
dc.date.available2022-05-05T09:31:43Z
dc.date.issued2021
dc.identifier.issn2380-632X
dc.identifier.otherWOS:000784773200051
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39749.2
dc.sourceWOS
dc.titleIR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs
dc.typeProceedings paper
dc.contributor.imecauthorSisto, Giuliano
dc.contributor.imecauthorChehab, Bilal
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorChen, Rongmei
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/IITC51362.2021.9537541
dc.identifier.eisbn978-1-7281-7632-1
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/39749.2*2022-05-05T09:27:03Zvalidation by library/open access desk
120.500.12860/397492022-05-05T02:17:41Z

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