dc.contributor.author | Genneret, B. | |
dc.contributor.author | Chou, R. | |
dc.contributor.author | Sisto, Giuliano | |
dc.contributor.author | Chehab, Bilal | |
dc.contributor.author | Baert, Rogier | |
dc.contributor.author | Chen, Rongmei | |
dc.contributor.author | Weckx, Pieter | |
dc.contributor.author | Ryckaert, Julien | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Milojevic, Dragomir | |
dc.date.accessioned | 2022-05-05T09:31:43Z | |
dc.date.available | 2022-05-05T02:17:41Z | |
dc.date.available | 2022-05-05T09:31:43Z | |
dc.date.issued | 2021 | |
dc.identifier.issn | 2380-632X | |
dc.identifier.other | WOS:000784773200051 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39749.2 | |
dc.source | WOS | |
dc.title | IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Sisto, Giuliano | |
dc.contributor.imecauthor | Chehab, Bilal | |
dc.contributor.imecauthor | Baert, Rogier | |
dc.contributor.imecauthor | Chen, Rongmei | |
dc.contributor.imecauthor | Weckx, Pieter | |
dc.contributor.imecauthor | Ryckaert, Julien | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Milojevic, Dragomir | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/IITC51362.2021.9537541 | |
dc.identifier.eisbn | 978-1-7281-7632-1 | |
dc.source.numberofpages | 3 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC) | |
dc.source.conferencedate | JUL 06-09, 2021 | |
dc.source.conferencelocation | Virtual | |
dc.source.journal | na | |
imec.availability | Published - imec | |