Publication:
IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs
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1753 since deposited on 2022-05-05
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Acq. date: 2026-01-08
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Views
1753 since deposited on 2022-05-05
1last month
1last week
Acq. date: 2026-01-08
Citations