Publication:

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

Date

2021
Proceedings Paper
https://doi.org/10.1109/iitc51362.2021.9537541
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Author(s)

Genneret, B.
;
Chou, R.
;
Sisto, Giuliano  
;
Chehab, Bilal  
;
Baert, Rogier  
;
Chen, Rongmei  
;
Weckx, Pieter  
;
Ryckaert, Julien  
;
Van der Plas, Geert  
;
Beyne, Eric  
;
Milojevic, Dragomir  

Journal

na

Abstract

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1776 since deposited on 2022-05-05
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Acq. date: 2026-09-16

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