Publication:

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

Date

2021

Proceedings Paper

https://doi.org/10.1109/IITC51362.2021.9537541

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Author(s)

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Sisto, Giuliano

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Ryckaert, Julien

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Van der Plas, Geert

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Milojevic, Dragomir

Journal

na

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Acq. date: 2026-04-06