Publication:

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

Date

2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537541
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dc.contributor.authorGenneret, B.
dc.contributor.authorChou, R.
dc.contributor.authorSisto, Giuliano
dc.contributor.authorChehab, Bilal
dc.contributor.authorBaert, Rogier
dc.contributor.authorChen, Rongmei
dc.contributor.authorWeckx, Pieter
dc.contributor.authorRyckaert, Julien
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorMilojevic, Dragomir
dc.contributor.imecauthorSisto, Giuliano
dc.contributor.imecauthorChehab, Bilal
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorChen, Rongmei
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-05-05T09:31:43Z
dc.date.available2022-05-05T02:17:41Z
dc.date.available2022-05-05T09:31:43Z
dc.date.issued2021
dc.identifier.doi10.1109/IITC51362.2021.9537541
dc.identifier.eisbn978-1-7281-7632-1
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39749
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
dc.source.numberofpages3
dc.subject.keywordsDIE
dc.title

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

dc.typeProceedings paper
dspace.entity.typePublication
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