Browsing Conference contributions by imec author "2b1b9a40a5042a44aba1e9ff0f2fc7fa8aa8d32a"
Now showing items 1-7 of 7
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Additives in Cu plating for microelectronics applications
Radisic, Alex; Ross, Frances; Haesevoets, Karel; Struyf, Herbert; Vereecken, Philippe (2018) -
Atomic layer deposition of 2D transition metal dichalogenides
Delabie, Annelies; Caymax, Matty; Groven, Benjamin; Heyne, Markus; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Bender, Hugo; Conard, Thierry; Verdonck, Patrick; Van Elshocht, Sven; Heyns, Marc; Barla, Kathy; Radu, Iuliana; Thean, Aaron (2015-10) -
CuNi alloy electrodeposition for microbumps using benzotriazole
Haesevoets, Karel; Radisic, Alex; Vereecken, Philippe (2018) -
Electrochemical deposition seeding mechanisms of CuNi-alloys (for novel chip technologies)
Haesevoets, Karel; Vereecken, Philippe; Radisic, Alex (2016) -
Monolayer controlled deposition of 2D transition metal dichalcogenides on large area substrates
Delabie, Annelies; Groven, Benjamin; Heyne, Markus; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Verdonck, Patrick; Van Elshocht, Sven; Heyns, Marc; Caymax, Matty; Barla, Kathy; Radu, Iuliana; Thean, Aaron (2015) -
Plasma enhanced atomic layer deposition of two-dimensional WS2 from WF6, H2S and H2 plasma precursors
Groven, Benjamin; Heyne, Markus; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Conard, Thierry; Verdonck, Patrick; Van Elshocht, Sven; Heyns, Marc; Radu, Iuliana; Delabie, Annelies; Caymax, Matty (2015) -
Reducing agents for the atomic layer deposition of WS2 from the WF6 and H2S precursors
Delabie, Annelies; Heyne, Markus; Groven, Benjamin; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Verdonck, Patrick; Van Elshocht, Sven; Heyns, Marc; Radu, Iuliana; Caymax, Matty (2015-07)