Browsing Conference contributions by author "Fehkuhrer, Andreas"
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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jurgen; Fehkuhrer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri; Phommahaxay, Alain; Beyne, Eric (2021)