Browsing Conference contributions by author "La Tulipe, Douglas Charles"

Now showing items 1-6 of 6

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021)
Confined IMCs for low temperature and high throughput D2W bonding

Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022)
Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021)
Fundamental study of IMC grains at low anneal temperature

Gerets, Carine; Derakhshandeh, Jaber; Shafahian, Ehsan; Cochet, Tom; La Tulipe, Douglas Charles; Beyer, Gerald; Miller, Andy; Beyne, Eric (2022)
Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022)
Overlay challenges in 3D heterogeneous integration

Grauer, Yoav; Miller, Andy; La Tulipe, Douglas Charles; Manassen, Amnon; Eisenbach, Shlomo; Bachar, Ohad; Gronheid, Roel (2022)

Browsing Conference contributions by author "La Tulipe, Douglas Charles"

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps ﻿

Confined IMCs for low temperature and high throughput D2W bonding ﻿

Demonstration of a collective hybrid die-to-wafer integration using glass carrier ﻿

Fundamental study of IMC grains at low anneal temperature ﻿

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking ﻿

Overlay challenges in 3D heterogeneous integration ﻿

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

Confined IMCs for low temperature and high throughput D2W bonding

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Fundamental study of IMC grains at low anneal temperature

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Overlay challenges in 3D heterogeneous integration