Browsing Conference contributions by title

P300 detection based on feature extraction in on-line brain-computer interface

Chumerin, Nikolay; Manyakov, Nikolay V.; Combaz, Adrien; Suykens, Johan A. K.; Yazicioglu, Refet Firat; Torfs, Tom; Merken, Patrick; Pereira Neves, Hercules; Van Hoof, Chris; Van Hulle, Marc M. (2009)

P3HT:PCBM bulk heterojunction solar cells: morphological and electrical characterization and performance optimization

Aernouts, Tom; Vanlaeke, Peter; Haeldermans, Ilse; D'Haen, Jan; Heremans, Paul; Poortmans, Jef; Manca, Jean (2007)

Package level interconnect options

Balachandran, Jayaprakash; Brebels, Steven; Carchon, Geert; Webers, Tomas; De Raedt, Walter; Nauwelaers, Bart; Beyne, Eric (2005)

Packaging and assembly challenges for 50G silicon photonics interposers

Snyder, Brad; Mangal, Nivesh; Lepage, Guy; Balakrishnan, Sadhishkumar; Sun, Xiao; Pantano, Nicolas; Rakowski, Michal; Bogaerts, Lieve; De Heyn, Peter; Verheyen, Peter; Miller, Andy; Pantouvaki, Marianna; Absil, Philippe; Van Campenhout, Joris (2018)

Packaging approach for nano-CMOS wiring

Balachandran, Jayaprakash; Brebels, Steven; Carchon, Geert; De Raedt, Walter; Nauwelaers, Bart; Beyne, Eric (2005-06)

Packaging for MEMS and MST devices: the indent reflow sealing method

Tilmans, Harrie; Van De Peer, Myriam; Beyne, Eric (2000)

Packaging in the world of ambient intelligence?

Mertens, Robert (2002)

Packaging of 11MPixel CMOS-integrated SiGe micro-mirror arrays

Witvrouw, Ann; Tilmans, Harrie; Bogaerts, Lieve; De Moor, Piet; Bearda, Twan; Halder, Sandip; Haspeslagh, Luc; Schlatmann, Bart; van Bommel, Mark; de Nooijer, Christine; Lauria, John; Vanneer, Roel; van Drieenhuizen, Bert (2009)

Packaging of opto-electronic devices for flexible applications

Bosman, Erwin; Van Steenberge, Geert; Missinne, Jeroen; Van Hoe, Bram; Van Daele, Peter (2010)

Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems

Van Steenberge, Geert; Roelkens, Gunther; Ossieur, Peter; Missinne, Jeroen; Van Asch, Jef; Zhang, Jing; Qin, Senbiao; Van Campenhout, Joris; Van Kerkhof, J.; Milosevic, M. M.; Bakopoulos, P.; Syrivelis, D.; Mentovich, E.; Morozov, K.; Stracca, S.; Bigongiari, A.; Joerg, T.; Schlick, D.; Braun, T.; Woehrmann, M.; Gernhardt, R.; Cheng, Q.; Li, T.; Penty, R. (2023)

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Mangal, Nivesh; Missinne, Jeroen; Van Steenberge, Geert; Van Campenhout, Joris; Snyder, Brad (2017)

Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip

Rits, Olivier; Bockstaele, R.; Naessens, Kris; Baets, Roel (2005)