Recently added

N2 Nanosheet Pathfinding-PDK (P-PDKTM) Including Back-Side PDN

Farokhnejad, Anita; Sahoo, Siva Satyendra; Abdi, Dawit; Cousins, Jack; Dutta, Arka; Mirabelli, Gioele; Sankatali, Venkateswarlu; Verschueren, Lynn; Yang, Sheng; Zografos, Odysseas; Myers, James; Weckx, Pieter; Garcia Bardon, Marie; Hellings, Geert; Ryckaert, Julien (2024)

Understanding Anti-ferroelectric Behavior and Wake-up in La Doped HZO Metal-Ferroelectric-Metal Capacitors Using Nucleation Limited Switching Model

Walke, Amey; Clima, Sergiu; Popovici, Mihaela Ioana; Van Houdt, Jan (2024)

Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks

Chang, Xinyue; Oprins, Herman; Vermeersch, Bjorn; Cherman, Vladimir; Lofrano, Melina; Park, Seongho; Tokei, Zsolt; De Wolf, Ingrid (2024)

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Kumar, Nitish; Chen, Yukai; Sankatali, Venkateswarlu; Mishra, Subrat; Gupta, Ankur; Singh, Pushpapraj; Catthoor, Francky; Myers, James; Ryckaert, Julien; Biswas, Dwaipayan (2024)

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

De Messemaeker, Joke; Van Sever, Koen; Tsau, Yan Wen; Zhang, Boyao; Croes, Kristof; Beyne, Eric (2024)

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Sun, Xiao; Su, Chin-Ya; Chen, Shih-Hung; Chew, Soon Aik; Zhang, Boyao; Beyne, Eric (2024)

Methodologies for Characterization of W2W Bonding Strength

Gonzalez, Mario; Vanstreels, Kris; Okudur, Oguzhan Orkut; Iacovo, Serena; Beyne, Eric (2024)

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

Chery, Emmanuel; Bhatia, Ritwik; Sundaram, Ganesh; Pinho, Nelson; Beyne, Eric (2024)

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Chancerel, Francois; Urban, Peter; Slabbekoorn, John; Halas, Simon; Bravin, Julian; Brems, Steven; Uhrmann, Thomas; Wimplinger, Markus; Phommahaxay, Alain; Beyne, Eric (2024)

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Pantano, Nicolas; Stucchi, Michele; Van der Plas, Geert; Beyne, Eric (2024)

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections

Park, Jae-Woo; Pantano, Nicolas; Van Der Plas, Geert; Beyne, Eric; Chun, Jung-Hoon (2024)

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Ji, Xinrui; Du, Leiming; van Zeijl, Henk; Zhang, Guoqi; Derakhshandeh, Jaber; Beyne, Eric (2024)

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Kang, Shuo; Iacovo, Serena; D'have, Koen; Van Huylenbroeck, Stefaan; Okudur, Oguzhan Orkut; Alexeev, Anton; Plach, Thomas; Probst, Gernot; Ding, Taotao; Wimplinger, Markus; Uhrmann, Thomas; De Vos, Joeri; Beyer, Gerald; Beyne, Eric (2024)

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Kennes, Koen; Lin, Ye; Suhard, Samuel; Bex, Pieter; Cuypers, Dieter H.; Guerrero, Alice; Bumueller, Dennis; Phommahaxay, Alain; Beyer, Gerald; Beyne, Eric (2024)

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Lin, Ye; Bex, Pieter; Kennes, Koen; Derakhshandeh, Jaber; Dhakras, Prathamesh; Suhard, Samuel; Gerets, Carine; Dewilde, Sven; Georgieva, Violeta; Jourdain, Anne; Beyer, Gerald; Beyne, Eric (2024)

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery

Allebosch, Gianni; Vanhees, Matthias; Luong, Hiep; Veelaert, Peter; Booth, Brian (2024)

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz

ElKashlan, Rana; Yadav, Sachin; Khaled, Ahmad; Xiao, Dongping; Kazemi Esfeh, Babak; Yu, Hao; Alian, AliReza; Peralagu, Uthayasankaran; Collaert, Nadine; Parvais, Bertrand (2024)

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications

ElKashlan, Rana; Yu, Hao; Peralagu, Uthayasankaran; Yadav, Sachin; Kazemi Esfeh, Babak; Alian, AliReza; Banerjee, Sourish; Xiao, Dongping; Parvais, Bertrand; Collaert, Nadine (2024)

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers

Duflou, Rutger; Houssa, Michel; Lockhart de la Rosa, Cesar Javier; Kar, Gouri Sankar; Afzalian, Aryan (2024)

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity.

Fleischmann, Claudia; Uedono, Akira; Scheerder, Jeroen; Soulie, Jean-Philippe; Park, Seongho; Adelmann, Christoph; Tokei, Zsolt (2024)

Conference contributions: Recent submissions

N2 Nanosheet Pathfinding-PDK (P-PDKTM) Including Back-Side PDN ﻿

Understanding Anti-ferroelectric Behavior and Wake-up in La Doped HZO Metal-Ferroelectric-Metal Capacitors Using Nucleation Limited Switching Model ﻿

Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks ﻿

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology ﻿

Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding ﻿

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices ﻿

Methodologies for Characterization of W2W Bonding Strength ﻿

Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers ﻿

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism ﻿

Impact of Pitch Scaling on 3D Die-to-Die Interconnects ﻿

A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections ﻿

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering ﻿

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers ﻿

Multi-tier die stacking through collective die-to-wafer hybrid bonding. ﻿

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm ﻿

Real-time video enhancement for the removal of surgical lighting artifacts in computer-assisted orthopedic surgery ﻿

Large-Signal Characterisation and Analysis of AlN/GaN MISHEMTs on Si with a PAE > 62% at 28 GHz ﻿

InAlN/GaN-on-Si HEMTs with an InGaN Back Barrier for mm-Wave Applications ﻿

DFT-NEGF transport in 2D channels with semimetal contacts: the influence of doping and bilayers ﻿

Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity. ﻿