Recently added

Investigation of wafer level packaging schemes for 3D RF interposer multi-chip module

Vereecke, Bart; Soussan, Philippe; Zhu, Jian (2017)

Techno-economic analysis of reliable ICT networks and services

Verbrugge, Sofie (2017)

Piecing the puzzle – Self-publishing queryable research data on the Web

Verborgh, Ruben (2017)

First real-time 100-Gb/s NRZ-OOK transmission over 2 km with a silicon photonic electro-absorption modulator

Verbist, Jochem; Verplaetse, M.; Srivinasan, S. A.; De Heyn, Peter; De Keulenaer, T.; Pierco, R.; Vaernewyck, R.; Vyncke, Arno; Absil, Philippe; Torfs, Guy; Yin, Xin; Roelkens, Gunther; Van Campenhout, Joris; Bauwelinck, Johan (2017)

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator

Verbist, Jochem; Verplaetse, M.; Srinivasan, S.A.; De Heyn, Peter; De Keulenaer, T.; Vaernewyck, R.; Pierco, R.; Vyncke, A.; Verheyen, Peter; Balakrishnan, Sadhishkumar; Lepage, Guy; Pantouvaki, Marianna; Absil, Philippe; Yin, Xin; Roelkens, Gunther; Torfs, Guy; Van Campenhout, Joris; Bauwelinck, Johan (2017-06)

DAC-less and DSP-free PAM-4 transmitter at 112 Gb/s with two parallel GeSi electro-absorption modulators

Verbist, Jochem; Lambert, J.; Verplaetse, Michiel; Van Kerrebrouck, Joris; Srinivasan, Ashwyn; De Heyn, Peter; De Keulenaer, T.; Yin, Xin; Van Campenhout, Joris; Roelkens, Gunther; Bauwelinck, Johan (2017)

A 25 Gb/s all-digital clock and data recovery circuit for burst mode applications in PONs

Verbeke, Marijn; Rombouts, Pieter; Ramon, Hannes; Torfs, Guy; Bauwelinck, Johan; Yin, Xin (2017-09)

Challenges on surface conditioning in 3D device architectures: triple-gate FinFETs, gate-all-around lateral and vertical nanowire FETs

Veloso, Anabela; Paraschiv, Vasile; Vecchio, Emma; Devriendt, Katia; Li, Waikin; Simoen, Eddy; Chan, BT; Tao, Zheng; Rosseel, Erik; Loo, Roger; Milenin, Alexey; Kunert, Bernardette; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; van Dorp, Dennis; Altamirano Sanchez, Efrain; Brus, Stephan; Marien, Philippe; Fleischmann, Claudia; Melkonyan, Davit; Huynh Bao, Trong; Eneman, Geert; Hellings, Geert; Sibaja-Hernandez, Arturo; Matagne, Philippe; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2017)

Challenges on surface conditioning in 3D device architectures: triple-gate finFETs, gate-all-around lateral and vertical nanowireFETs

Veloso, Anabela; Paraschiv, Vasile; Vecchio, Emma; Devriendt, Katia; Li, Waikin; Simoen, Eddy; Chan, BT; Tao, Zheng; Rosseel, Erik; Loo, Roger; Milenin, Alexey; Kunert, Bernardette; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; van Dorp, Dennis; Altamirano Sanchez, Efrain; Brus, Stephan; Marien, Philippe; Sibaja-Hernandez, Arturo; Matagne, Philippe; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2017)

Insights and opportunities for junctionless gate-all-around lateral and vertical nanowire FETs

Veloso, Anabela; Matagne, Philippe; Simoen, Eddy; Vaisman Chasin, Adrian; Kaczer, Ben; Yakimets, Dmitry; Mocuta, Dan; Collaert, Nadine (2017)

An engagement-related behavioral change approach for saving SavingFood in Greece

Veeckman, Carina; Vanobberghen, Wim; Kalemaki, Eirini; Madesi, Vasia; Theodoridis, Alexander (2017)

Privacy-Preserving Behavioral Authentication on Smartphones

Vassallo, Gabriele; Preuveneers, Davy; Van Hamme, Tine; Joosen, Wouter (2017)

Stretchable platform enabled with wireless power for smart contact lenses

Vasquez Quintero, Andres; Verplancke, Rik; De Smet, Herbert; De Smet, Jelle; Vanfleteren, Jan (2017)

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits

Vasquez Quintero, Andres; Vanfleteren, Jan; Bossuyt, Frederick; Plovie, Bart; Verplancke, Rik; De Smet, Herbert (2017)

High resolution silicon-on-insulator mid-infrared spectrometers operating at 3.3 μm

Vasiliev, Anton; Muneeb, Muhammad; Baets, Roel; Roelkens, Gunther (2017)

Removal of respiratory influences from heart rate during emotional stress

Varon, Carolina; Lazaro, Jesus; Hernando, Alberto; Caicedo, Alexander; Van Huffel, Sabine; Bailon, Raquel (2017)

Reliability study on cobalt and ruthenium as alternative metals for advance interconnects

Varela Pedreira, Olalla; Croes, Kristof; Lesniewska, Alicja; Wu, Chen; van der Veen, Marleen; De Messemaeker, Joke; Vandersmissen, Kevin; Jourdan, Nicolas; Wen, Liang Gong; Adelmann, Christoph; Briggs, Basoene; Vega Gonzalez, Victor; Boemmels, Juergen; Tokei, Zsolt (2017)

Conference contributions: Recent submissions

Investigation of wafer level packaging schemes for 3D RF interposer multi-chip module

Techno-economic analysis of reliable ICT networks and services

Piecing the puzzle – Self-publishing queryable research data on the Web

First real-time 100-Gb/s NRZ-OOK transmission over 2 km with a silicon photonic electro-absorption modulator

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator

DAC-less and DSP-free PAM-4 transmitter at 112 Gb/s with two parallel GeSi electro-absorption modulators

A 25 Gb/s all-digital clock and data recovery circuit for burst mode applications in PONs

Challenges on surface conditioning in 3D device architectures: triple-gate FinFETs, gate-all-around lateral and vertical nanowire FETs

Challenges on surface conditioning in 3D device architectures: triple-gate finFETs, gate-all-around lateral and vertical nanowireFETs

Insights and opportunities for junctionless gate-all-around lateral and vertical nanowire FETs

An engagement-related behavioral change approach for saving SavingFood in Greece

Privacy-Preserving Behavioral Authentication on Smartphones

Stretchable platform enabled with wireless power for smart contact lenses

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits

High resolution silicon-on-insulator mid-infrared spectrometers operating at 3.3 μm

Removal of respiratory influences from heart rate during emotional stress

Reliability study on cobalt and ruthenium as alternative metals for advance interconnects

Designing and evaluating a smart cow monitoring from a techno-economic perspective

Control Flow Aware Software-Implemented Fault Injection for Embedded CPUs

Discovering logical vulnerabilities in the Wi-Fi handshake using model-based testing

Conference contributions: Recent submissions

Investigation of wafer level packaging schemes for 3D RF interposer multi-chip module ﻿

Techno-economic analysis of reliable ICT networks and services ﻿

Piecing the puzzle – Self-publishing queryable research data on the Web ﻿

First real-time 100-Gb/s NRZ-OOK transmission over 2 km with a silicon photonic electro-absorption modulator ﻿

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator ﻿

DAC-less and DSP-free PAM-4 transmitter at 112 Gb/s with two parallel GeSi electro-absorption modulators ﻿

A 25 Gb/s all-digital clock and data recovery circuit for burst mode applications in PONs ﻿

Challenges on surface conditioning in 3D device architectures: triple-gate FinFETs, gate-all-around lateral and vertical nanowire FETs ﻿

Challenges on surface conditioning in 3D device architectures: triple-gate finFETs, gate-all-around lateral and vertical nanowireFETs ﻿

Insights and opportunities for junctionless gate-all-around lateral and vertical nanowire FETs ﻿

An engagement-related behavioral change approach for saving SavingFood in Greece ﻿

Privacy-Preserving Behavioral Authentication on Smartphones ﻿

Stretchable platform enabled with wireless power for smart contact lenses ﻿

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits ﻿

High resolution silicon-on-insulator mid-infrared spectrometers operating at 3.3 μm ﻿

Removal of respiratory influences from heart rate during emotional stress ﻿

Reliability study on cobalt and ruthenium as alternative metals for advance interconnects ﻿

Designing and evaluating a smart cow monitoring from a techno-economic perspective ﻿

Control Flow Aware Software-Implemented Fault Injection for Embedded CPUs ﻿

Discovering logical vulnerabilities in the Wi-Fi handshake using model-based testing ﻿

Investigation of wafer level packaging schemes for 3D RF interposer multi-chip module

Techno-economic analysis of reliable ICT networks and services

Piecing the puzzle – Self-publishing queryable research data on the Web

First real-time 100-Gb/s NRZ-OOK transmission over 2 km with a silicon photonic electro-absorption modulator

Real-time 100 Gb/s NRZ-OOK transmission with a silicon photonics GeSi electro-absorption modulator

DAC-less and DSP-free PAM-4 transmitter at 112 Gb/s with two parallel GeSi electro-absorption modulators

A 25 Gb/s all-digital clock and data recovery circuit for burst mode applications in PONs

Challenges on surface conditioning in 3D device architectures: triple-gate FinFETs, gate-all-around lateral and vertical nanowire FETs

Challenges on surface conditioning in 3D device architectures: triple-gate finFETs, gate-all-around lateral and vertical nanowireFETs

Insights and opportunities for junctionless gate-all-around lateral and vertical nanowire FETs

An engagement-related behavioral change approach for saving SavingFood in Greece

Privacy-Preserving Behavioral Authentication on Smartphones

Stretchable platform enabled with wireless power for smart contact lenses

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits

High resolution silicon-on-insulator mid-infrared spectrometers operating at 3.3 μm

Removal of respiratory influences from heart rate during emotional stress

Reliability study on cobalt and ruthenium as alternative metals for advance interconnects

Designing and evaluating a smart cow monitoring from a techno-economic perspective

Control Flow Aware Software-Implemented Fault Injection for Embedded CPUs

Discovering logical vulnerabilities in the Wi-Fi handshake using model-based testing