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Articles
Beyond-Cu Intermediate-Length Interconnect Exploration for SRAM Application
Publication:
Beyond-Cu Intermediate-Length Interconnect Exploration for SRAM Application
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Date
2022
Journal article
https://doi.org/10.1109/TNANO.2022.3157952
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pei, Zhenlin
;
Catthoor, Francky
;
Tokei, Zsolt
;
Pan, Chenyun
Journal
IEEE TRANSACTIONS ON NANOTECHNOLOGY
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202
since deposited on 2022-08-09
30
last month
6
last week
Acq. date: 2025-12-14
Views
1623
since deposited on 2022-08-09
4
last month
1
last week
Acq. date: 2025-12-14
Citations