dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Van Der Plas, Geert | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2023-01-05T12:39:17Z | |
dc.date.available | 2022-09-17T02:52:04Z | |
dc.date.available | 2023-01-05T12:39:17Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300237 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40438.2 | |
dc.source | WOS | |
dc.title | Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Van Der Plas, Geert | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00244 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 8 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1531 | |
dc.source.endpage | 1538 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
dc.source.journal | na | |
imec.availability | Published - imec | |