dc.contributor.author | Thakare, Devesh | |
dc.contributor.author | Wu, Meiyi | |
dc.contributor.author | Opsomer, Karl | |
dc.contributor.author | Detavernier, Christophe | |
dc.contributor.author | Naujok, Philipp | |
dc.contributor.author | Saadeh, Qais | |
dc.contributor.author | Soltwisch, Victor | |
dc.contributor.author | Delabie, Annelies | |
dc.contributor.author | Philipsen, Vicky | |
dc.date.accessioned | 2023-02-23T13:32:07Z | |
dc.date.available | 2022-09-19T02:51:16Z | |
dc.date.available | 2023-02-23T13:32:07Z | |
dc.date.issued | 2022 | |
dc.identifier.isbn | 978-1-5106-4977-4 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.other | WOS:000850450900011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40463.3 | |
dc.source | WOS | |
dc.title | Evaluation of Ta-Co alloys as novel high-k EUV mask absorber | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Thakare, Devesh | |
dc.contributor.imecauthor | Wu, Meiyi | |
dc.contributor.imecauthor | Opsomer, Karl | |
dc.contributor.imecauthor | Delabie, Annelies | |
dc.contributor.imecauthor | Philipsen, Vicky | |
dc.contributor.orcidimec | Thakare, Devesh::0000-0003-3265-7042 | |
dc.contributor.orcidimec | Delabie, Annelies::0000-0001-9739-7419 | |
dc.contributor.orcidimec | Philipsen, Vicky::0000-0002-2959-432X | |
dc.identifier.doi | 10.1117/12.2614235 | |
dc.identifier.eisbn | 978-1-5106-4978-1 | |
dc.source.numberofpages | 20 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 120510D | |
dc.source.conference | Conference on Optical and EUV Nanolithography XXXV Part of SPIE Advanced Conference | |
dc.source.conferencedate | APR 24-MAY 27, 2022 | |
dc.source.conferencelocation | San Jose | |
dc.source.journal | Proceedings of SPIE | |
dc.source.volume | 12051 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The authors acknowledge that this project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 783247 -TAPES3 (Technology Advances for Pilot line of Enhanced Semiconductors for 3 nm). This Joint Undertaking receives support from the European Union's Horizon 2020 research and innovation program alongside Netherlands, Belgium, Germany, France, Austria, United Kingdom, Israel, Switzerland. The authors would like to thank the Materials and Component Analysis (MCA) department at IMEC for material characterizations. We would also like to recognize Markus Foltin's contribution to durability studies during his time at IMEC, as an assignee of the Suss MicroTec Photomask Equipment GmbH. Finally, we thank Synopsys (R) for providing the S-litho EUV simulation tool. | |