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Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations

dc.contributor.authorSpessot, Alessio
dc.contributor.authorSalahuddin, Shairfe Muhammad
dc.contributor.authorEscobar Gavilanez, Ricardo
dc.contributor.authorRitzenthaler, Romain
dc.contributor.authorXiang, Yang
dc.contributor.authorBudhwani, Rahul Kumar
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorCapogreco, Elena
dc.contributor.authorBastos, Joao
dc.contributor.authorChen, Yangyin
dc.contributor.authorHoriguchi, Naoto
dc.date.accessioned2023-06-13T10:02:02Z
dc.date.available2022-10-30T02:55:00Z
dc.date.available2023-06-13T10:02:02Z
dc.date.issued2022
dc.identifier.issn2330-7978
dc.identifier.otherWOS:000869001800038
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40643.2
dc.sourceWOS
dc.titleThermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
dc.typeProceedings paper
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorSalahuddin, Shairfe Muhammad
dc.contributor.imecauthorEscobar Gavilanez, Ricardo
dc.contributor.imecauthorRitzenthaler, Romain
dc.contributor.imecauthorXiang, Yang
dc.contributor.imecauthorBudhwani, Rahul Kumar
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorCapogreco, Elena
dc.contributor.imecauthorBastos, Joao
dc.contributor.imecauthorChen, Yangyin
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecSalahuddin, Shairfe Muhammad::0000-0002-6483-8430
dc.contributor.orcidimecRitzenthaler, Romain::0000-0002-8615-3272
dc.contributor.orcidimecXiang, Yang::0000-0003-0091-6935
dc.contributor.orcidimecBastos, Joao::0000-0002-8877-9850
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.identifier.doi10.1109/IMW52921.2022.9779308
dc.identifier.eisbn978-1-6654-9947-7
dc.source.numberofpages4
dc.source.peerreviewyes
dc.source.beginpage148
dc.source.endpage151
dc.source.conference14th IEEE International Memory Workshop (IMW)
dc.source.conferencedateMAR 15-18, 2022
dc.source.conferencelocationDresden
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/40643.2*2023-06-13T09:59:54Zvalidation by library/open access desk
120.500.12860/406432022-10-30T02:55:00Z

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